Micro Electromechanical Systems (MEMS) are already evident in many of the appliances we use every day. Examples include onboard sensors in automobiles, such as collision sensors in airbags; print head modules for inkjet printers; RF devices in mobile communication devices such as mobile phones; and small (form factor) camera modules. Recently, Research and Development (R&D) has focused on expanding applications for MEMS in the automobile, household appliances, medical care, biotechnology, social welfare, and aerospace sectors.

Working with SPTS in the U.K. as a strategic partner and SPP technologies Co., Ltd., a joint venture with SPTS, we will continue to support the evolution of MEMS technologies worldwide.

As a leading supplier of silicon deep-etch systems and silicon oxide sacrificial layer etching systems indispensable for MEMS manufacturing, SPP offers a wide range of solutions to support the increasing demands of volume manufacturers. By building on established technologies, SPP develops solutions for a broad range of companies who are beginning to implement advanced processing technologies in areas such as power MOSFET and advanced packaging techniques on 200mm and 300mm wafers (3D packaging and Chip Scale Packages).

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