Cold plate, with brazed corrugated fin

SPP’s cold plate is made by our own technology of plate-fin structure. Due to high density corrugated fins by press forming are brazed inside liquid passage, significant performance (i.e. low heat resistance) is achieved.

Structure

Features

・Low heat resistance, Optimum design

• Selection of optimum corrugated fins to fit your requirement.
• High density corrugated fins realizes low heat resistance and compact cooling system.

• 

  Plain type

• 

  Perforate type

• 

  Serrated type

・Flexibility in design

• Large size available (Max: 1.3*1.8m)
• Liquid / water passage is designed to fit your requirement, for size, arrangement, and required cooling performance.
• Double side component attachment is available.
• Thermal performance can be evaluated with both numerical simulation and experiment of actual products.

Benefit of our Cold plate

By SPP's cold plate, you can reduce your initial cost and maintenance cost within total system.
Due to high density corrugated fins by press forming are brazed inside liquid passage, comparing to extrusion or serpentine single channel type, lower heat resistance is achieved. (Rθ≦5 - 2K/kW)
If cold plate has higher thermal performance (i.e. low heat resistance), circulated fluid temperature can be higher. It makes easier to release heat to ambient, and it means your radiators, fans, chiller, etc. can be smaller.

2 phase cooler "SIPHOREX®" (Product name in Europe: TERAPHASE)

"SIPHOREX®" is air cooling solution with 2 phase phenomenon, which has better performance than classical heat sink or heat pipe cooler. Refrigerant is enclosed inside of brazed plate-fin heat exchanger and components are cooled by principal of thermo-siphon. This is a medium solution between liquid cooling and air cooling for electronic device cooling. It has cooling capacity similar to liquid cooling, but it still result in simple system configuration like air cooling.

Basic structure

Features of "SIPHOREX®"

・Compact, Lightweight

Plate-fin structured radiation (condensation) part enables compact, lightweight cooling system.

・ΔT between air and modules can be smaller than air cooling

Since boiling part is filled with uniform temperature liquid,
In case heat from modules are (e.g. IGBTs) the same;
-> Temperature distribution on every component becomes almost uniform.
Even though in case heat from each modules are different;
-> Temperature distribution on cooling surface and ΔT between air and modules become much smaller than heat sink.

・Devices with “high heat density” or “heat spot” can be cooled

・Flexibility in design

“SIPHOREX®” vs. Heat sink

SIPHOREX® achieves more than half Rθ.

Main benefits of "SIPHOREX®"

Application example of "SIPHOREX®"

"SIPHOREX®" is used for IGBT cooling of frequency invertors.

Heat sink, with large size, high density and thin walled fin

SPP's Aluminum heat sink is made by pressed fin forming and brazing technology. Our heat sink is custom-made, and optimum design is proposed.

Features

• ・Small fin pitch, various heights is possible.
• ・Large size available (Max. 1.3m by 1.8m plane)
• ・Heat transfer enhancement processing to fins is possible.
• ・Heat pipe can be embedded in base plate, for improving heat dissipation.

Corrugate fin brazed type

Plate brazed type

Application example: IGBT cooler for electric locomotive



Application example: IGBT cooler for inter city train

Embedded heat pipe